导电胶
2020-07-27 14:40:12

EXBOND 8300C

It has been formulated for die attach application with high throughput, automatic die attach equipment; It can provide excellent rheology property which can avoid tailing or stringing problems.

Product Feastures

  • Solvent-free;
  • high reliability;
  • Excellent dispensability with minimal tailing and stringing;
  • Good adhesion on various materials.